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13
Chapter 1: Introduction
Motherboard Features
CPU
•
This motherboard supports dual Intel Xeon Scalable-SP and 2nd Gen Intel Xeon Scalable-SP series processors (Socket
P) which offer three Intel® Ultra Path Interconnect (UPI) links of up to 10.4 GT/s
Note:
Both CPUs need to be installed for full access to the PCIe slots, DIMM slots, and onboard controllers. Refer
to the block diagram to determine which slots or devices may be affected.
Memory
•
Integrated memory controller supports up to 6TB of 3DS Load Reduced DIMM (3DS LRDIMM)/Load Reduced DIMM
(LRDIMM)/3DS Registered DIMM (3DS RDIMM)/Registered DIMM (RDIMM) DDR4 (288-pin) ECC 2933*/2666/2400/2133
MHz modules in 24 slots (
Notes:
1.
Support for 2933MHz memory is dependent on the CPU SKU.
2.
Up to 9TB memory
is supported with DCPMM modules installed.)
DIMM Size
•
Up to 128GB at 1.2V
Note 1:
Memory speed support depends on the processors used in the system.
Note 2:
For the latest CPU/memory updates, please refer to our website at
http://www.supermicro.com/products/
Chipset
•
Intel C621
Expansion Slots
•
Two PCIe 3.0 x16 slots (JPCIE)
•
Four PCIe 3.0 x16 connectors
BaseBoard Management Controller (BMC)
•
ASPEED AST 2500 Baseboard Controller (BMC) supports IPMI 2.0
•
One dedicated IPMI LAN located on the rear IO backpanel
Graphics
•
Graphics controller via AST 2500 BMC
I/O Devices
•
Ethernet LAN Ports
•
Two 10GbE Ethernet LAN ports 1/2 on the I/O back panel
•
IPMI Dedicated LAN
•
One Gigabit IPMI LAN supported by the AST 2500 BMC the I/O back panel
•
Serial (COM) Port
•
One Fast UART 16550 port
•
SATA 3.0
•
Three SATA 3.0 connections supported by a SATA headers via bridge card
(JHDD3-5)
•
Three SATA 3.0 on board connectors
•
RAID (PCH)
•
RAID 0, 1, 5, 10
Motherboard Features
Содержание X11DPG-HGX2
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