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Appendix B: System Specifications
Appendix B
System Specifications
Processor Support
Dual 3rd Generation Intel® Xeon® Scalable processorss in an LGA4189 socket; UPI up to 10.4GT/s; supports CPU TDP up to
205W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621A
BIOS
AMI 128Mb SPI Flash EEPROM
Memory
4TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz in 16
memory slots and up to 4TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHz
Storage Drives
60 3.5/2.5" hot-swap SAS3 drive bays
Two 7-mm or one 15-mm internal NVMe drive bays (optional)
Two internal 2.5" SATA3 drive bays (per node)
Two NVMe M.2 (per node)
PCI Expansion Slots
Three PCIe 4.0 x16 low-profile slots (CPU SLOT 1, 2, 3)
Two PCIe 3.0 x2 NVMe M.2 slots (supports M-Key 2280 and 22110, on mezzanine board)
Input/Output
Network: Two 10GBaseT Ethernet LAN ports (Intel X550 controller)
One RJ45 dedicated BMC LAN port
One serial (COM) port
One VGA port
Two USB 3.0 ports (on the rear I/O panel)
Motherboard
X12DSC-6; Length 14.8", width 10.9" (376 mm x 277 mm)
Chassis
CSV-947STS-R2K63P; 4U Rackmount, 7 x 17.6 x 34.1 in. / 178 x 447 x 866mm
System Cooling
Six 8-cm heavy duty fans
Power Supply
Model: PWS-2K63A-1R, Titanium Level Power Supply (80 Plus)
AC Input Voltages: 200-240 Vac
Rated Input Current: 15A max. (200-240V)
Rated Input Frequency: 50-60 Hz
Rated Output Power: 2600W
Rated Output Voltages: 200-240V: +12V (216 max.), +12Vsb (3.5A max)
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)