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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Gen Intel Xeon Scalable processors in a P+ (LGA-4189) socket with up to 40 cores and a thermal design power (TDP) of
up to 270W
Chipset
Intel PCH C621A
BIOS
256Mb AMI BIOS SPI Flash
Memory
Up to 2TB of ECC RDIMM/LRDIMM/LRDIMM 3DS with speeds up to 3200MHz in eight slots; DIMM size Up to 256GB at 1.2V
Storage Drives
Thirty-six 3.5" hot-swap SATA/SAS bays
(Optional) Two rear 2.5" hot-swap SATA or NVMe bays
One M.2 SSD, PCIe 3.0 x4/SATA3 slot, M-Key 2280/22110
Two SATADOM (disk on module)
PCI Expansion Slots
Two PCI-Express 4.0 x16 low profile
Two PCI-Express 4.0 x8 low profile (one in a x16 slot)
Input/Output
LAN: Two 10G BASE-T; one dedicated BMC port
USB: Two USB 2.0 ports
Two USB 3.2 Gen 1 ports
One VGA port
Motherboard
X12SPI-TF; 12.1" (L) x 10" (W) (307.34mm x 254mm)
Chassis
847BTS-R1K23LPBP4; 4U; (WxHxD) 17.2 x 7.0 x 27.5 in. (437 x 178 x 699 mm)
System Cooling
Seven 8-cm heavy duty fans with Optimal Fan Speed Control
One air shroud
Power Supply
Model: PWS-1K23A-1R, 1200W redundant modules, 80Plus Titanium levell
AC Input
100-240 Vac, Rated Input Frequency: 50-60 Hz
Rated Input Current: 15-12A (100-127Vac) / 825-7A (200-240Vac)
Rated Output Power: 1200W
Rated Output Voltages:
+12V (83A at 100-127Vac, 100A at 200-240Vac), +5Vsb (4A)
+5 V standby: 4A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
