Appendix C: System Specifications
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Appendix C
System Specifications
Processors
Dual Intel Xeon 82xx/62xx/52xx/42xx/32xx or 81xx/61xx/51xx/41xx/31xx processors in a P (LGA3647) type socket
Note:
Please refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C621 chipset
BIOS
128 Mb AMI Flash ROM
Memory
Twenty-four slots for up to 6 TB of 3DS Load Reduced DIMM (3DS LRDIMM), 3DS Registered DIMM (3DS RDIMM), or up to
3 TB of Load Reduced DIMM (LRDIMM) with speeds of up to 2933 MHz; support for Non-Volatile DIMM (NVDIMM) and Intel
Optane DC Persistent Memory (DCPMM); DIMM size up to 256 GB at 1.2 V
Drive Bays
Twenty-four hot-swap 2.5" bays: 24 NVMe (4 SAS/SATA hybrid ports - SAS3 via opt. AOC)
Two rear hot-swap 2.5" SATA
M.2: 1 M.2 NVMe (2242/2260/2280*/22110*); 1 M.2 SATA (2242/2260/2280*/22110*) via optional SATA cable
PCI Expansion Slots
Two full height x16 PCI-E slots
One low profile x8 PCI-E 3.0 slot
Motherboard
X11DPU; Length 17.0", width 16.8" (431.8 mm x 426.7 mm)
Chassis
SC219UB2TS-R1K62P-TN24; 2U Rackmount, (WxHxD) 17.2 x 3.5 x 27.8 in. (437 x 89 x 706 mm)
System Cooling
Four 80x80x38 mm, 9.5K RPM fans, two CPU heatsinks, two air shrouds to direct air flow
Weight
Net Weight: 39 lbs (17.7 kg)
Gross Weight: 63 lbs (28.6 kg)
Power Supply
Model: PWS-1K62A-1R,
1600/1000 W redundant 80Plus Titanium level modules
Input:
100-127Vac / 13 - 9A / 50-60Hz
200-240Vac / 10 - 8A / 50-60Hz
+12V
Max: 83.3A / Min: 0A (100-127Vac)
Max: 133A / Min: 0A (200-240Vac)
12Vsb: Max: 2.1A / Min: 0A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
