ECB-H61102H
Avoid the dusty, humidity and temperature extremes. Do
not place the product in any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The
figure comes from the request of the main chipset)
Generally speaking, dramatic changes in temperature
may lead to contact malfunction and crackles due to constant
thermal expansion and contraction from the welding spots’ that
connect components and PCB. Computer should go through
an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation
phenomenon. These water drops attached on PCB or the
surface of the components can bring about phenomena as
minor as computer instability resulted from corrosion and
oxidation from components and PCB or as major as short
circuit that can burn the components. Suggest starting the
computer until the temperature goes up.
The increasing temperature of the capacitor may
decrease the life of computer. Using the close case may
decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking.
The higher temperature may decrease the life of the device
and burned the capacitor.
Environmental Safety Instruction
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