List of tables
STM32L151xC/C-A STM32L152xC/C-A
6/133
DocID026119 Rev 5
2
C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
PCLK1
= 32 MHz, V
DD
= VDD_I2C = 3.3 V). . . . . . . . . . . . . . . . . . . . . . . . 95
max . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data . . . . . . . 115
LQPF100, 14 x 14 mm, 100-pin low-profile quad flat package mechanical data . . . . . . . 117
LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data. . . . . . . . . . 120
UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array
WLCSP64, 0.400 mm pitch package recommended PCB design rules . . . . . . . . . . . . . . 127
STM32L151xC/C-A and STM32L152xC/C-A ordering information scheme . . . . . . . . . . . 131