Stihl BT 131, Инструкция по эксплуатации

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conductive surface such as aluminum foil, to prevent electrostatic charge build up or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not
classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use Freon-propelled chemicals. These can generate electrical charges sufficient to
damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately
before you are ready to install it. (Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil or comparable conductive
material).
7. Immediately before removing the protective material from the leads of a replacement ES
device, touch the protective material to the chassis or circuit assembly into which the device
will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
2.3 General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that
will maintain tip temperature within the range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts
lead.
3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be
soldered. Use a mall wire-
4. bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use Freon-propelled spray-
on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal
temperature (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly
draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F).