Sony XR3F-19B160, Руководство по обслуживанию

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TABLE OF CONTENTS
1. DISASSEMBLY
....................................................... 3
2. DIAGRAMS
2–1. Block Diagram –SERVO Section– ................................. 6
2–2. Block Diagram –MAIN Section– ................................... 7
2–3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 8
2–4. Printed Wiring Boards –SERVO Section– ..................... 9
2–5. Schematic Diagram –SERVO Section (1/2)– ................. 10
2–6. Schematic Diagram –SERVO Section (2/2)– ................. 11
2–7. Printed Wiring Boards –MAIN Section– ....................... 12
2–8. Schematic Diagram –MAIN Section– ............................ 13
2–9. Printed Wiring Board –KEY Board– .............................. 14
2–10. Schematic Diagram –KEY Board– ................................. 14
2–11. IC Pin Function Description ........................................... 15
3. EXPLODED VIEWS
............................................... 17
4. ELECTRICAL PARTS LIST
................................ 21
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properties
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board. (within 3 times)
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED
LINE WITH MARK
!
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK OR BASE UNIT