8
XM-1600GSD
SECTION 3
DIAGRAMS
(
): SIDE B
D1
G-6
(D2)
F-8
D3
F-7
D5
E-6
(D8)
F-8
D9
E-7
D11
D-7
(D12)
D-9
(D13)
D-9
(D14)
D-10
(D15)
E-5
(D16)
E-5
(D19)
C-2
(D20)
C-12
(FET1)
G-2
(FET2)
G-2
(FET3)
F-2
(FET4)
E-2
(FET5)
D-2
(FET6)
D-2
(FET7)
G-12
(FET8)
G-12
(FET9)
F-12
(FET10)
E-12
(FET11)
D-12
(FET12)
D-12
IC1
G-7
IC2
G-8
IC3
G-6
IC4
G-9
IC5
D-7
(IC6)
D-3
IC7
F-6
IC8
D-8
(LED1)
D-14
(LED2)
E-14
(LED3)
F-14
(LED4)
G-14
(PTC1)
E-8
(PTC2)
F-8
(Q1)
F-8
(Q2)
F-7
(Q3)
D-8
(Q4)
E-8
Q5
F-7
Q6
F-7
Q7
E-6
Q8
E-6
Q9
E-6
Q10
G-10
Q11
G-6
(Q12)
C-3
Q13
C-3
Q14
F-6
Q15
F-6
Q16
E-6
Q17
E-9
(Q18)
E-8
(Q19)
E-9
(Q20)
F-9
(Q21)
E-9
(Q22)
E-9
(Q23)
E-9
(Q24)
E-10
(Q25)
E-9
(Q26)
E-10
(Q27)
F-9
(Q28)
F-10
(Q29)
F-9
(Q30)
F-10
(Q31)
F-9
(Q32)
G-9
(Q33)
G-8
Q34
G-10
Q35
D-9
Q36
E-8
Q39
F-6
Q42
F-7
Q43
F-7
Q44
E-6
(ZD1)
G-8
(ZD2)
G-7
(ZD3)
D-7
(ZD4)
D-7
(ZD5)
F-8
Ref. No.
Location
• Semiconductor Location
Ref. No.
Location
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
OSC
REF. REG.
ERROR
ERROR
0.1V
NON INV
+IN
NON INV
-IN
NON INV
-IN
NON INV
+IN
PWMCOMP
IN
DEADTIME
CONTROL
CT
RT
GND
C1
E1
E2
C2
VCC
OUTPUT
CONTROL
VREF
IC6 TL494CN
• IC Block Diagram
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from +12 V and REMOTE terminals.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
for printed wiring boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
z
: Through hole.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Waveform
1
IC6
5
(CT)
3.2Vp-p
12µsec
Содержание XM-1600GSD Marketing Specifications, Connections
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