82
KLV-26HG2
KLV-26HG2
REF. NO.
PART NO.
DESCRIPTION
VALUES
REF. NO.
PART NO.
DESCRIPTION
VALUES
R4306
1-216-864-11
SHORT CHIP
R4307
1-216-864-11
SHORT CHIP
R4308
1-216-864-11
SHORT CHIP
R4309
1-216-864-11
SHORT CHIP
R4310 1-216-825-11 METAL
CHIP
2.2K 5% 1/10W
MSB
*
A-1410-385-A
MSB BOARD, MOUNTED
CAPACITOR
C4501 1-162-964-11 CERAMIC
CHIP
0.001µF
10%
50V
C4502 1-164-156-11 CERAMIC
CHIP
0.1µF 25V
C4503 1-137-894-21 ELECT
CHIP
470µF 20%
25V
C4504 1-107-892-91 ELECT
4700µF
20%
25V
C4505 1-135-960-91 CERAMIC
CHIP
10µF 10%
25V
CONNECTOR
CN4501
1-573-290-21
PIN, CONNECTOR (1.5MM) (SMD) 4P
CN4502 1-779-884-11 CONNECTOR
4P
DIODE
D4501 8-719-080-41 DIODE
RB063L-30TE25
D4502 6-500-294-01 DIODE
PTZ-TE25-3.9B
D4503 8-719-080-41 DIODE
RB063L-30TE25
FERRITE BEAD
FB4501
1-216-295-91
SHORT CHIP
IC
IC4501 6-704-407-01 IC
PQ1CZ41H2ZPH
COIL
L4501 1-456-504-21 INDUCTOR
100µH
RESISTOR
R4501 1-218-861-11 METAL
CHIP
3.9K 0.50%
1/10W
R4502 1-218-856-11 METAL
CHIP
2.4K 0.50%
1/10W
G1
*
A-1410-789-A
G1 BOARD, MOUNTED
4-382-854-01
SCREW (M3X8), P, SW (+)
*
7-322-065-48
RUBBER, SILICONE RTV (KE-3490)
* A6002 4-042-408-02 PIN(45),
WIRE
A6004
4-098-139-01
HEAT SINK (G2) C
CAPACITOR
C6002 1-119-895-51 CERAMIC
4700pF
20%
250V
C6003 1-161-964-91 CERAMIC
0.0047µF
250V
C6004 1-165-530-11 MYLAR
0.47µF 10 275V
C6005 1-165-529-11 MYLAR
0.22µF 10 275V
C6006 1-119-895-51 CERAMIC
4700pF
20%
250V
C6007 1-161-964-91 CERAMIC
0.0047µF
250V
C6008 1-100-877-11 ELECT
270µF 20%
250V
C6009 1-100-877-11 ELECT
270µF 20%
250V
C6010 1-100-877-11 ELECT
270µF 20%
250V
C6011 1-100-877-11 ELECT
270µF 20%
250V
C6012 1-136-201-61 MYLAR
0.22µF 10%
400V
C6013 1-162-970-11 CERAMIC
CHIP
0.01µF 10%
25V
C6015 1-162-960-11 CERAMIC
CHIP
220pF 10%
50V
C6016 1-162-964-11 CERAMIC
CHIP
0.001µF
10%
50V
C6017 1-107-905-11 ELECT
4.7µF 20%
50V
C6018 1-107-888-11 ELECT
47µF 20%
25V
C6019 1-136-479-11 FILM
0.001µF
5% 100V
C6020 1-162-970-11 CERAMIC
CHIP
0.01µF 10%
25V
C6021 1-107-906-11 ELECT
10µF 20%
50V
C6023 1-136-203-11 MYLAR
0.01µF 5% 630V
C6025 1-107-826-11 CERAMIC
CHIP
0.1µF 10%
16V
C6026 1-162-970-11 CERAMIC
CHIP
0.01µF 10%
25V
C6027 1-136-165-00 FILM
0.1µF 5% 50V
C6028 1-165-585-21 ELECT
CHIP
47µF 20%
25V
C6029 1-126-398-11 ELECT
CHIP
4.7µF 20%
35V
C6030 1-107-909-11 ELECT
47µF 20%
50V
C6031 1-131-872-91 CERAMIC
CHIP
1000pF
10%
630V
C6032 1-107-824-11 CERAMIC
220pF 5% 1KV
C6033 1-107-824-11 CERAMIC
220pF 5% 1KV
C6034 1-135-871-22 FILM
15000pF
3% 800V
C6035 1-135-871-22 FILM
15000pF
3% 800V
C6036 1-128-361-11 ELECT
CHIP
470µF 20%
10V
MSX MSB G1
Содержание WEGA KLV 26HG2
Страница 38: ...38 KLV 26HG2 KLV 26HG2 DVI RECEIVER UD COMPONENT SIDE CONDUCTOR SIDE 1 2 A 1 2 A ...
Страница 47: ...KLV 26HG2 KLV 26HG2 47 POWER SUPPLY G1 COMPONENT SIDE CONDUCTOR SIDE 1 2 3 4 5 6 A B 1 2 3 4 5 6 A B ...
Страница 121: ...KLV 26HG2 UC 3 24 COMPONENT SIDE CONDUCTOR SIDE G1 POWER SUPPLY G1 BOARD 1 2 3 4 5 6 A B 1 2 3 4 5 6 A B ...
Страница 125: ...KLV 26HG2 UC 3 28 COMPONENT SIDE CONDUCTOR SIDE UD DVI RECEIVER UD BOARD 1 2 A 1 2 A ...
Страница 174: ...KLV 26HG2 UC 89 Sony EMCS Corporation Ichinomiya TEC English 2004DL08 Data Made in Japan 2004 4 9 878 207 02 ...