KDE-37XS955/42XS955 (UC) 4
TABLE OF CONTENTS
1. DISASSEMBLY ............................................ 1-1
1-1.
SERVICE POSITION ........................................ 1-1
1-1-1. PANELS AND CAP REMOVAL ................. 1-1
1-1-2. WOOFER BLOCK REMOVAL ................... 1-1
1-1-3. REAR COVER ASSY REMOVAL .............. 1-1
1-2.
STAND REMOVAL .......................................... 1-2
1-3.
REAR COVER ASSY REMOVAL .................. 1-2
1-4.
QU BOARD REMOVAL .................................. 1-3
1-5.
QM AND QT BOARDS REMOVAL ............... 1-3
1-6.
A2FU, DE1, DIC3 AND M1U
BOARDS REMOVAL ....................................... 1-4
1-7.
A1U, H2, P AND QH BOARDS REMOVAL
............................................................................ 1-4
1-8.
G1, G2F AND K BOARDS REMOVAL .......... 1-5
1-9.
F AND H1U BOARDS REMOVAL ................. 1-5
1-10. PLASMA DISPLAY PANEL
ASSY REMOVAL ............................................. 1-6
1-11. H3 AND H4 BOARDS REMOVAL ................. 1-7
1-12. H5 BOARD REMOVAL ................................... 1-7
2. ADJUSTMENTS
and TROUBLESHOOTING .......................... 2-1
2-1.
WHITE BALANCE ADJUSTMENT ................ 2-1
2-1-1. Measurement equipment ................................ 2-1
2-1-2. Measuring procedure ..................................... 2-1
2-1-3. Service mode .................................................. 2-1
2-2.
TROUBLESHOOTING ..................................... 2-2
3. DIAGRAMS ................................................... 3-1
3-1.
BLOCK DIAGRAMS ........................................ 3-1
(1) A1U AND H2 BOARDS .................................. 3-1
(2) A2FU (1/2) BOARD ......................................... 3-2
(3) A2FU (2/2) AND H4 BOARDS ....................... 3-3
(4) DE1 BOARD .................................................... 3-4
(5) DIC3 BOARD ................................................... 3-5
(6) F AND G1 BOARD .......................................... 3-6
(7) G2F BOARD ..................................................... 3-7
(8) K BOARD ......................................................... 3-8
(9) H1U, H3, H5 AND M1U BOARDS ................ 3-9
(10) P BOARD ........................................................ 3-10
(11) QH AND QM BOARDS ................................ 3-11
(12) QT AND QU BOARDS .................................. 3-12
3-2.
FRAME DIAGRAMS ........................................ 3-13
3-3.
CIRCUIT BOARDS LOCATION ..................... 3-14
3-4.
SCHEMATIC DIAGRAMS AND
PRINTED WIRING BOARDS ........................ 3-14
(1)
Schematic Diagrams of A1U Board .............. 3-15
(2)
Schematic Diagrams of A2FU Board ............ 3-19
(3)
Schematic Diagrams of DE1 Board .............. 3-22
(4)
Schematic Diagrams of DIC3 Board ............. 3-27
(5)
Schematic Diagram of F Board ..................... 3-34
(6)
Schematic Diagrams of G1 Board ................. 3-35
(7)
Schematic Diagrams of G2F Board ............... 3-38
(8)
Schematic Diagram of H1U and H2 Boards
........................................................................ 3-41
(9)
Schematic Diagram of H3 and H4 Boards
........................................................................ 3-42
(10) Schematic Diagram of H5 Board .................. 3-43
(11) Schematic Diagram of K Board .................... 3-44
(12) Schematic Diagrams of M1U Board ............. 3-46
(13) Schematic Diagram of P Board ..................... 3-52
(14) Schematic Diagram of QH Board .................. 3-54
(15) Schematic Diagrams of QM Board ............... 3-55
(16) Schematic Diagrams of QT Board ................ 3-60
(17) Schematic Diagram of QU Board .................. 3-63
3-5.
SEMICONDUCTORS ....................................... 3-64
4. EXPLODED VIEWS ...................................... 4-1
4-1.
REAR COVER ASSY AND STAND ............... 4-2
4-2.
CHASSIS-1 ........................................................ 4-4
4-3.
CHASSIS-2 ........................................................ 4-5
4-4.
CHASSIS-3 ........................................................ 4-6
4-5.
CHASSIS-4 ........................................................ 4-7
4-6.
PACKING MATERIALS .................................. 4-8
5. ELECTRICAL PARTS LIST ........................ 5-1
Содержание WEGA KDE-37XS955
Страница 44: ...KDE 37XS955 42XS955 UC 3 26 DE1 MCU CPU TRANSMITTER DE1 BOARD CONDUCTOR SIDE COMPONENT SIDE 1 2 3 A 1 2 3 A ...
Страница 80: ...KDE 37XS955 42XS955 UC 3 62 CONDUCTOR SIDE QT DEMODULATOR POD CONTROL QT BOARD COMPONENT SIDE ...
Страница 169: ...KDE 37 42XS955 UC 168 Sony EMCS Corporation Ichinomiya TEC English 2004KL08 Data Made in Japan 2004 11 9 878 258 03 ...