D-E888/E999/EJ825/EJ925
91
120
31
60
61
TP
(GND)
TP614
(RF)
B
C
D
E
F
G
H
I
J
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A
05
!
91
120
31
60
61
TP
(GND)
TP614
(RF)
B
C
D
E
F
G
H
I
J
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A
05
!
– 21 –
– 22 –
– 23 –
– 24 –
5-4.
PRINTED WIRING BOARD – MAIN Board (Suffix-11) –
5-5.
PRINTED WIRING BOARD – MAIN Board (Suffix-12) –
Note on Printed Wiring Boards (Suffix-11 and -12):
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• MAIN board is multi-layer printed board. However, the patterns
of intermediate-layer have not been included in the diagram.
• Semiconductor
Location
(Suffix-11 and -12)
IC602
F-7
IC603
F-6
IC801
H-11
Q301
F-9
Q302
F-9
Q401
I-13
Q402
H-13
Q403
H-12
Q404
H-4
Q405
J-13
Q406
I-2
Q407
G-5
Q408
I-4
Q409
H-15
Q410
G-5
Q411
D-10
Q414
H-14
Q601
F-7
Q602
E-7
Ref. No.
Location
Ref. No.
Location
D302
H-10
D401
H-5
D402
H-12
D403
I-12
D404
I-15
D405
I-15
D406
H-4
D407
G-5
D408
I-5
D409
D-6
D410
H-2
D411
I-14
D413
E-6
D601
F-10
D801
I-5
IC351
G-10
IC401
H-13
IC402
D-10
IC403
D-6
IC601
E-10
