CHAPTER1.
BLOCK DIAGRAM
1-1.VPCEA Series (for E
x
tern
a
l Gr
a
phi
c
Models)
C
am
er
a
Module
35001 bus
CRT
DMI X4
800/1066/(1333) MHz
4 USB
4 PCIE
SO-DIMM 0
800/1066/1
333
MHz
DDR(III)
20
4
pin
800/1066/(1333) MHz
SO-DIMM 1
800/1066 MHz
DDR(III)
20
4
pin
CK505
SL287
4
8CLC
X.TAL
14.318MHz
GFX
AMD
M
a
dison-
LP M2
P
a
rk-XT
M2
PCIE X16
CRT
LVDS
WSXGA
LVDS
HDMI
TMDS
HDA
Digit
a
l Mi
c
Int.Spe
a
ker
1.0 W
a
lt
x
2
Mini-PCIE C
a
rd
(WLAN)
Bluetooth
SATA
ODD
SATA
HDD
2 SATA
Ri
c
oh R5U2
3
1
C
a
rdRe
a
der
i.Link
E
x
press C
a
rd
34mm
CAM (0.
3
M)
FAN
Lid Swit
c
h
Fl
a
sh BIOS
1M bit X 1
BATT ID
PWM/TACH
GPIO
SP1
SMBus 1
Ther
ma
l Sensor
W8
3
L771AWG (VGA)
Tou
c
h
PAD
MS DUO(HG)
SD CARD
Feli
ca
Ethernet GbE
88E8057
M
a
r
v
ell
10/100/1000
Tr
a
nsfor
m
er
LANKo
m
LG-2
4
19P-1
RJ
4
5
BATT
CONN
SMBus 2
USB 2.0/ eSATA
Co
m
bo Conn.
Re
a
ltek
ALC269
w/ Cl
a
ss D A
m
p
Arr
a
nd
a
le
Pro
c
essor
Mi
c
ro-FCBGA-988A
(988-pin rPGA so
c
ket)
SATA
USB 3
GDDR
3
VRAM
M
a
dison
DDR
3
1GB(1Gb
x
8p
c
s)
P
a
rk
DDR
3
512MB(1Gb
x4
p
c
s)
PCH
Ibe
x
Pe
a
k-M
(HM55)
(USB
x
12)
(PCIE
x
8)
(SATA
x 4
)
676
m
BGA
Fl
a
sh BIOS
3
2M bit X 1
SPI
[Sony Confidential]
VPCEA Series (9-852-872-XX)
USB 2.0/
CONN.X
3
He
a
dphone
w/ SPDIF J
ac
k
E
x
t. Mi
c
In J
ac
k
Pre-AMP
Swit
c
h
DB
Winbond
NPCE78
3
L
LQFP-128
1-1
