Sony SCD-XB770, Руководство по обслуживанию

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SCD-XB770
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5-6. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
• Indication of transistor
C
B
These are omitted.
E
Q
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise
specified.
•
f
: internal component.
• 5 : fusible resistor.
• C : panel designation.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : SACD PLAY
(
) : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : SACD PLAY
c
: CD PLAY (ANALOG OUT)
I
: CD PLAY (DIGITAL OUT)
Note: The components identified by mark
0
or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• Circuit Boards Location
TRANS board
POWER board
RF board
AUDIO board
MAIN board
DISPLAY board
LOADING board
HP board
AC SW board
KEY board