
NW-S603/S605/S703F/S705F/S706F
25
25
NW-S603/S605/S703F/S705F/S706F
5-11. PRINTED WIRING BOARD – SUB Board –
: Uses unleaded solder.
R1303
R1306
JL1301
C1301
25
48
1
24
CN1301
21
22
1
2
SUB BOARD
(SIDE A)
SUB BOARD
(SIDE B)
1-871-593-
11
(11)
1-871-593-
11
(11)
(NW-S706F)
A
B
C
D
E
1
2
3
4
5-12. SCHEMATIC DIAGRAM – SUB Board –
0.1
C1301
R1303
0
IC1301
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
JL1301
CL1303
22P
CN1301
1
NAND_RB1
2
GND
3
NAND_RB0
4
NAND_XCE1
5
NAND_XWP
6
NAND_XCE0
7
NAND_XWE
8
NAND_XRE
9
NAND_CLE
10
NAND_ALE
11
NAND_AD6
12
NAND_AD7
13
NAND_AD4
14
NAND_AD5
15
NAND_AD2
16
NAND_AD3
17
NAND_AD0
18
NAND_AD1
19
VDD_NAND2.8
20
VDD_NAND2.8
21
GND
22
GND
R1306
0
NAND_XCE0
NAND_XWP
NAND_ALE
NAND_AD6
NAND_AD3
NAND_AD3
NAND_CLE
NAND_CLE
NAND_ALE
NAND_AD0
NAND_XWE
NAND_AD7
NAND_AD7
NAND_XRE
NAND_AD2
NAND_AD1
NAND_XWP
NAND_AD6
NAND_XWE
NAND_AD5
NAND_AD5
NAND_XRE
NAND_RB0
NAND_AD0
NAND_AD4
NAND_AD2
NAND_AD1
NAND_AD4
NAND_XCE0
NAND_RB1
NAND_RB0
NAND_RB1
TC58NVG3D4CTGOO(NW-S603/S703F)
TH58NVG4D4CTGOO(NW-S605/S705F)
K9HBG08U1M-PCB(NW-S706F)
(NW-S706F)
B
E
1
5
A
C
D
3
2
4
6
IC1301
NAND FLASH ROM
SUB BOARD
Note: When IC1301 on the SUB board is damaged, exchange
the new SUB board for the SUB board (included in MAIN
board) which IC damaged.