NW-S202/S202F/S203F/S205F
2
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
For Printed Wiring Boards.
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
• Lead Layouts
For Schematic Diagrams.
Note:
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4
Ω
or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Power voltage is dc 3.7 V and fed with regulated dc power
supply from CN601 pin
1
and pin
2
on the MAIN board.
• Voltages are dc with respect to ground under no-signal
conditions.
no mark: PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
• Voltage variations may be noted due to normal production
tolerances.
• Signal path.
F
: AUDIO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
*
Replacement of IC101 and IC201 on the MAIN board
used in this set requires a special tool.
*
Replacement of IC101 and IC201 on the MAIN board
used in this set requires a special tool.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A)
the parts face are indicated.
surface
Lead layout of conventional IC
CSP (chip size package)
2. DIAGRAMS