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Specifications ............................................................................ 1
1. GENERAL
....................................................................... 3
2. DISASSEMBLY
2-1. Chassis ASSY ............................................................. 7
2-2. LID, Case .................................................................... 7
2-3. LCD Unit .................................................................... 8
2-4. Main Board, Power Board .......................................... 8
3. TEST MODE
................................................................... 9
4. DIAGRAMS
4-1. Block Diagrams ........................................................ 11
4-2. Printed Wiring Boards (Main Section) ..................... 13
4-3. Schematic Diagram (Main Section) ......................... 15
4-4. Schematic Diagram (Power Section) ........................ 20
4-5. Printed Wiring Boards (Power Section) ................... 23
5. EXPLODED VIEW
5-1. Main Section ............................................................. 25
5-2. Case Section ............................................................. 26
6. ELECTRICAL PARTS LIST
................................... 27
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°
C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
• Replacement of CXD9534GG (IC710) used in the set requires a
special tool.
Ver 1.1 2000.07