Sony NV-U74, Руководство по обслуживанию

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NV-U74
NV-U74
19 19
X1002
500 mV/DIV, 10
µ
s/DIV
30.5
µ
s
1 Vp-p
X1001
500 mV/DIV, 20 ns/DIV
76.9 ns
1.1 Vp-p
IC3501 (XTLOUT)
1 V/DIV, 20 ns/DIV
40.7 ns
1.8 Vp-p
IC2501 (XO)
2 V/DIV, 20 ns/DIV
83.3 ns
3.4 Vp-p
IC3501 (BITCLK)
2 V/DIV, 20 ns/DIV
81 ns
4.1 Vp-p
X0102
200 mV/DIV, 10
µ
s/DIV
30.5
µ
s
0.5 Vp-p
X0101
200 mV/DIV, 20 ns/DIV
61.1 ns
0.7 Vp-p
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
speci fi ed.
• f : internal component.
•
C
: panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• Power voltage is dc 3.7V and fed with regulated dc power
supply from battery connector (CN3001).
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark: TEST MODE (COLOR BAR)
• Voltages are taken with a VOM (Input impedance 10
MW).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
E
: VIDEO
j
: NAVI
N : USB
P
: MEMORY STICK
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
• f : internal component.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A) Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Lead layouts
surface
CSP (Chip Size Package) Lead layout of conventional IC
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not
been included in diagram.
• Waveforms
– MAIN Board –
* Replacing of IC3504 on the MAIN board used in this
set requires a special tools
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
*
Replacing of IC3504 on the MAIN board used in this
set requires a special tools
Note: When the MAIN board is exchanged, it is necessary to
do some works. Con
fi rm the servicing notes “NOTE OF
REPLACING THE MAIN BOARD” (page 3).
Note: When the MAIN board is exchanged, it is necessary to
do some works. Con
fi rm the servicing notes “NOTE OF
REPLACING THE MAIN BOARD” (page 3).
• Indication of transistor.
C
B
These are omitted.
E
Q