26
MZ-E510
SECTION 6
DIAGRAMS
Common note on Printed Wiring Board:
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
surface
Lead layout of conventional IC
CSP (chip size package)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
*
Replacement of IC501, IC601 on
main board
requires a special tool.
•
Lead Layouts
Common note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
C
: panel designation.
•
A
: B+ Line.
• Total current is measured with Minidisc installed.
• Power voltage is dc 3V and fed with regulated dc power
supply from external power voltage jack.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: MD
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
• Waveforms
4
IC601
2
(OSCO)
(at the point of R601)
44.3ns
2
IC501
rd
(TE)(SL501)
500mV/DIV, 1ms/DIV
5
IC901
yd
(CLK)
3
IC501
rs
(FE)(SL502)
1
IC501
9
(RFO)(TP540)
500mV/DIV, 200ns/DIV
2.3Vp-p
580mVp-p
1.2Vp-p
1V/DIV, 2
µ
s/DIV
5.67
µ
s
2.5Vp-p
200mV/DIV, 1ms/DIV
290mVp-p
500mV/DIV, 20ns/DIV