HCD-SH2000
4
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or
unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to
fl
ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci
fi
ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The
fl
exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re
fl
ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
- BACK PANEL -
This appliance is
claassi
fi
ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.
Model
Part No.
E2, E51, EA, MY, SAF
4-275-656-0
[]
MX
4-275-656-1
[]
•
Abbreviation
E2
: 120 V AC area in E model
E51 : Chilean and Peruvian models
EA
: Saudi Arabian model
MX : Mexican model
MY : Malaysia model
SAF : South African model
PLAYABLE DISC
Format of discs
Logo
•
AUDIO CD
• CD-R/-RW in AUDIO
CD
format
• CD-R/-RW in DATA CD
format, containing MP3
audio
tracks
1)
that
conforms to ISO 9660
2)
Level 1/Level 2, Joliet
(in expansion format), or
Multi
Session
3)
1)
MP3 (MPEG 1 Audio Layer 3) is a standard format de
fi
ned
by ISO/MPEG which compresses audio data. MP3 audio
tracks must be in MPEG 1 Audio Layer 3 format.
2)
A logical format of
fi
les and folders on CD-ROMs, de
fi
ned
by ISO (International Organization for Standardization).
3)
This is a recording method that enables adding of data using
the Track-At-Once method. Conventional discs begin at a
disc control area called the Lead-in and end at an area called
Lead-out. A Multi Session disc is a disc having multiple
sessions, with each segment from Lead-in to Lead-out
regarded as a single session.
NOTE OF REPLACING THE IC102 AND IC4605 ON THE
DMB21 BOARD
IC102 and IC4605 on the DMB21 board cannot exchange with
single. When these parts on the DMB21 board are damaged,
exchange the entire mounted board.
NOTE OF REPLACEMENT OF THE MS-214 BOARD
When the MS-214 board is defective, exchange the entire MD
(AU) ASSY.
PART No.
Ver. 1.1
