MHC-V50/V50D
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to
fl
ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci
fi
ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The
fl
exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re
fl
ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
This appliance is classi
fi
ed as a CLASS 1
LASER product under IEC 60825-1:2007.
This marking is located on the rear exterior.
Model
Part No.
LA9
4-689-434-0
[]
AEP
4-689-434-4
[]
UK
4-689-434-4
[]
AUS
4-689-434-7
[]
US, CND
4-689-435-0
[]
• Abbreviation
AUS :
Australian
model
CND : Canadian model
LA9
: Latin-American model
PLAYABLE DISCS
• DVD
VIDEO
(V50D)
• DVD-R/DVD-RW in DVD VIDEO format or video
mode (V50D)
• DVD+R/DVD+RW in DVD VIDEO format (V50D)
• VIDEO CD (Ver. 1.0, 1.1, and 2.0 discs) (V50D)
• Super
VCD
(V50D)
• CD-R/CD-RW/CD-ROM in VIDEO CD format or super VCD
format
• AUDIO
CD
• CD-R/CD-RW in AUDIO CD format
PLAYABLE FILES ON DISCS/USB DEVICE
• Music:
MP3
fi
les
1)2)
(.mp3), WMA
fi
les
2)3)
(.wma), AAC
fi
les
2)3)
(.m4a/.mp4/.3gp), WAV
fi
les
3)
(.wav)
• Video (V50D): MPEG4
fi
les
4)
(.mp4/.m4v), Xvid
fi
les (.avi)
1)
MP3 (MPEG 1 Audio Layer 3) is a standard format de
fi
ned by
ISO/MPEG for compressed audio data. MP3
fi
les must be in
MPEG 1 Audio Layer 3 format.
2)
Files with copyright protection (Digital Rights Management)
cannot be played back by the system.
3)
USB device only.
4)
MPEG4
fi
les must be recorded in MP4
fi
le format. Supported
video codec and audio codec are as follows:
– Video codec: MPEG4 Simple Pro
fi
le (AVC is not supported.)
– Audio codec: AAC-LC (HE-AAC is not supported.)
Part No.
Destination Code
– Rear View –
MODEL NUMBER LABEL
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HOME AUDIO SYSTEM
MADE IN CHINA