Sony MEX-GS810BH, Руководство по обслуживанию

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46
MEX-GS810BH/N6000BH
SECTION 7
ELECTRICAL PARTS LIST
KEY BOARD
**********
When the KEY board is defective, replace the FRONT PANEL (SV) (ASSY) (Ref.
No. FP1).
*************************************************************
A-2045-586-A MAIN BOARD, COMPLETE (N6000BH) (See Note)
A-2045-587-A MAIN BOARD, COMPLETE (GS810BH) (See Note)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< CAPACITOR >
*
C03 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
C05 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
C09 1-116-707-11 CERAMIC CHIP 47uF 20% 10V
* C010 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
C013 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C016 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
C017 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
C018 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V
C019 1-116-722-11 CERAMIC CHIP 4.7uF 10% 16V
C020 1-118-480-11 CERAMIC CHIP 4.7uF 10% 6.3V
C021 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C022 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C023 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C102 1-116-733-11 CERAMIC CHIP 1uF 10% 25V
* C103 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
C104 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C105 1-118-477-11 CERAMIC CHIP 2.2uF 10% 6.3V
C106 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
* C107 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
C109 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C301 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C302 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C303 1-112-839-11 ELECT 4700uF 20% 16V
C304 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C305 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C306 1-118-361-11 CERAMIC CHIP 0.1uF 10% 50V
* C307 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
C308 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C309 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C310 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C311 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C312 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C313 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C314 1-118-930-11 CERAMIC CHIP 10uF 10% 10V
C315 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
* C316 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C317 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C318 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
* C319 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C320 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C321 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C322 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
* C323 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
C324 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
* C325 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
*
C326 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
C328 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C329 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C330 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C331 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C332 1-118-361-11 CERAMIC CHIP 0.1uF 10% 50V
C333 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C334 1-128-996-11 ELECT CHIP 4.7uF 20% 50V
(GS810BH)
C335 1-128-996-11 ELECT CHIP 4.7uF 20% 50V
(GS810BH)
C336 1-128-996-11 ELECT CHIP 4.7uF 20% 50V
(GS810BH)
C337 1-128-996-11 ELECT CHIP 4.7uF 20% 50V
(GS810BH)
C338 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C339 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C340 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C341 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C342 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C343 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C400 1-118-047-11 CERAMIC CHIP 10uF 10% 16V
(GS810BH)
C401 1-128-992-21 ELECT CHIP 47uF 20% 25V
*
C402 1-116-735-11 CERAMIC CHIP 1uF 10% 16V
(GS810BH)
C404 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
C405 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C406 1-124-779-00 ELECT CHIP 10uF 20% 16V
* C407 1-118-035-11 CERAMIC CHIP 0.1uF 10% 25V
(GS810BH)
C408 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C409 1-124-779-00 ELECT CHIP 10uF 20% 16V
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
When indicating parts by reference num-
ber, please include the board name.
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts speci
fi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “ * ” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
Metal- fi lm resistor.
METAL OXIDE: Metal oxide- fi lm resistor.
F: non fl ammable
• CAPACITORS
uF:
μ
F
• COILS
uH:
μ
H
• SEMICONDUCTORS
In each case, u:
μ
, for example:
uA. . :
μ
A. . , uPA. . ,
μ
PA. . ,
uPB. . :
μ
PB. . , uPC. . ,
μ
PC. . ,
uPD. . :
μ
PD. .
Note:
When the complete MAIN board is replaced, it is necessary to replace knob (VOL) (SV) assy simultaneously.
Also, the destination setting, Bluetooth operation check and Bluetooth information writing are necessary. Refer to
“DESTINATION SETTING METHOD” on page 4, “BLUETOOTH FUNCTION CHECKING METHOD USING
A CELLULAR PHONE” on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8.
KEY MAIN