— 3 —
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
rear exterior.
The following caution label is located
inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
The laser component in this product is
capable of emitting radiation exceeding
the limit for Class 1.
MODEL IDENTIFICATION
— BACK PANEL —
Parts No.
4-992-959-1
: AEP, UK, German model
4-992-959-2
: US model
4-992-959-3
: Canadian model
TABLE OF CONTENTS
1.
SERVICING NOTE
······················································ 4
2.
GENERAL
······································································ 7
3.
DISASSEMBLY
3-1.
Tray Assembly ···································································· 8
3-2.
Bracket (Motor) ASSY ······················································· 9
3-3.
Holder ASSY ······································································ 9
3-4.
Base Unit ·········································································· 10
3-5.
HMOT Board and HLIM Board ······································· 10
4.
TEST MODE
································································ 11
5.
ELECTRICAL ADJUSTMENTS
··························· 14
6.
DIAGRAMS
6-1.
BD Section ······································································· 19
6-2.
Digital Section ·································································· 21
6-3.
Audio Section ··································································· 23
6-4.
Power Section ··································································· 25
6-5.
Circuit Boards Location ··················································· 26
6-6.
Printed Wiring Board — BD Section — ·························· 28
6-7.
Schematic Diagram — BD Section — ····························· 31
6-8.
Schematic Diagram — Digital Section — ······················· 35
6-9.
Printed Wiring Board — Digital Section — ···················· 39
6-10. Printed Wiring Board — Audio Section — ······················ 42
6-11. Schematic Diagram — Audio Section — ························· 45
6-12. Schematic Diagram — Power Section — ························ 48
6-13. Schematic Diagram — Panel Section — ························· 51
6-14. Printed Wiring Board — Panel Section — ······················· 53
6-15. IC Block Diagrams ··························································· 56
6-16. IC Pin Functions ······························································· 61
7.
EXPLODED VIEWS
7-1.
Main Section ····································································· 73
7-2.
Chassis Section ································································· 74
7-3.
Front Panel Section 1 ······················································· 75
7-4.
Front Panel Section 2 ······················································· 76
7-5.
Mechanism Section 1 (MDM-4B) ···································· 77
7-6.
Mechanism Section 2 (MDM-4B) ···································· 78
7-7.
Mechanism Section 3 (MDM-4B) ···································· 79
7-8.
Base Unit Section (MBU-2B) ·········································· 80
8.
ELECTRICAL PARTS LIST
··································· 81
