– 39 –
– 40 –
6-3-6. PRINTED WIRING BOARD — SYSTEM BOARD —
MZ-E90
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
TP204
SYSTEM BOARD (SIDE A )
TP104
TP817
TP826
TP303
TP305
TP825
TP304
TP821
1-675-487-
TP824
BP801
TP822
TP816
TP823
TP819
TP818
TP820
TP815
SYSTEM BOARD (SIDE B)
1-675-487-
R103
R203
C304
C303
R302
R202
R102
R101
R806
C803
R801
R804
R803
C811
R827
C809
R201
C302
R104
R204
R303
R301
Q301
C802
R815
IC802
C808
X801
R810
R826
R802
IC801
C804
R808
R807
C102
04
C
E
13
18
6
7
12
24
19
1
B
IC301
C202
C306
C305
C301
C203
C103
C806
C807
1
5
10
15
20
45
40
35
30
25
MAIN BOARD CN801
26
50
4
1
5
8
CN803
TP829 TP830
1
87
99
102
103
117
119
115
112
98 97
96
88 86 83
89 85 84
82 79
73
69 64
52
49
46
43 45
40
37 38
35
39
36
33
26
25
24
19
12
9
8
6
2
58
60
55
68 65
67 66
11
11
( )
11
11
( )
R823
(Page 30)
IC301
H-4
IC801
G-8
IC802
G-10
Q301
I-3
• Semiconductor
Location
Ref. No.
Location
Note:
•
f
: internal component.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• System board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
*
IC801 is not replaceable
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
6
IC801
rg
(XTAL)
1.2Vp-p
16.9344MHz
• Waveforms
(MODE:PLAY)