– 11 –
– 12 –
M-430
5-2. PRINTED WIRING BOARD
Note:
•
X
: parts extracted from the component side.
•
b
: Pattern from the side which enables seeing.
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
HRPE901
REC/PB/ERASE
HEAD
(REC/PB)
(ERASE)
HD+
HD–
HE+
HE–
(
)
D102
G-3
IC101
D-6
IC601
E-9
• Semiconductor
Location
Ref. No.
Location
