KE-32TS2E (HK) 3
TABLE OF CONTENTS
1. DISASSEMBLY ..................................... 1-1
1-1. REAR COVER REMOVAL ................................. 1-1
1-2. MAIN SHIELD REMOVAL .................................. 1-1
1-3. STAND BASE ASSEMBLY REMOVAL .............. 1-2
1-4. Q BOARD REMOVAL ......................................... 1-2
1-5. B BOARD REMOVAL ......................................... 1-3
1-6. TU BOARD REMOVAL ....................................... 1-3
1-7. H1 BOARD REMOVAL ....................................... 1-4
1-8. H2 BOARD REMOVAL ....................................... 1-4
1-9. SUPPORT REMOVAL ........................................ 1-5
1-10. SWITCHING REGULATOR REMOVAL ........... 1-5
1-11. PLASMA DISPLAY PANEL REMOVAL ........... 1-6
2. ADJUSTMENTS .................................... 2-1
2-1. Adjustment of A/D Converter and Video Coder . 2-1
2-1-1. Preparation for adjustment ................................... 2-1
2-1-2. RGB input adjustment .......................................... 2-1
2-1-3. Component input adjustment ................................ 2-1
2-1-4. Video input adjustment ......................................... 2-1
2-1-5. Video coder input adjustment ............................... 2-2
2-2. White Balance Adjustment ................................. 2-2
2-3. Adjustment of sub-color and sub-hue ................ 2-2
3. DIAGRAMS ............................................ 3-1
3-1. BLOCK DIAGRAMS ........................................... 3-1
3-2. CIRCUIT BOARDS LOCATION ......................... 3-5
3-3. SCHEMATIC DIAGRAMS AND PRINTED
WIRING BOARDS .............................................. 3-5
(1) B Board .................................................................. 3-6
(2) H1 Board ................................................................ 3-14
(3) H2 Board ................................................................ 3-15
(4) Q Board .................................................................. 3-16
(5) TU Board ............................................................... 3-20
3-4. SEMICONDUCTORS ......................................... 3-22
4. EXPLODED VIEWS ............................... 4-1
4-1. COVER ............................................................... 4-2
4-2. CHASSIS ............................................................ 4-3
4-3. PACKING MATERIALS ...................................... 4-4
5. ELECTRICAL PARTS LIST ................... 5-1