- 3 -
SE-1
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
Lead Free Soldered Boards
example 1
example 2
Lead Free Solder material must be used to comply with environmental requirements of new solder joints. Lead Free Solder is available under
the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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CAUTION
SECTION 1 GENERAL
Содержание KDL-32U2520
Страница 9: ... 8 SE 1 RM ED007 SECTION 2 DISASSEMBLY 2 1 STAND REMOVAL 2 2 REAR COVER REMOVAL ...
Страница 10: ... 9 SE 1 RM ED007 2 3 SPEAKER REMOVAL 2 4 A1 BOARD REMOVAL ...
Страница 12: ... 11 SE 1 RM ED007 2 7 H1 BOARD REMOVAL 2 8 H2 BOARD REMOVAL ...
Страница 13: ... 12 SE 1 RM ED007 2 9 H3 BOARD REMOVAL 2 10 BRACKET REMOVAL ...
Страница 14: ... 13 SE 1 RM ED007 2 11 LCD PANEL REMOVAL Six screws ...
Страница 99: ...9 927 575 02 Sony Corporation Sony UK Service Promotions Dept English 08AP7100 1 Printed in U K 2008 1 ...