- 3 -
SE-1
RM-ED007
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. F1, H1 etc [ see examples ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
CAUTION
Lead Free Soldered Boards
example 1
example 2
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to
http://www.sony-training.com
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Содержание KDL-26P2520
Страница 20: ... 20 SE 1 RM ED007 2 9 H3 H3P BOARD REMOVAL 2 10 LCD PANEL REMOVAL H3 H3P Board Two screws Six screws LCD Panel ...
Страница 45: ...A B C D E F G H I J K L M N 1 2 3 4 5 6 7 8 9 10 11 O 45 BDTR 2 Printed Wiring Board Conductor Side B ...
Страница 86: ...9 927 542 01 Sony Corporation Sony UK Service Promotions Dept English 07AP7100 1 Printed in U K 2007 01 ...