HT-ST9
HT-ST9
61
61
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
f
: Internal component.
•
2
: Non
fl
ammable resistor.
•
5
: Fusible resistor.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
L
:
USB
d
:
LAN
G
: WIRELESS LAN/Bluetooth
E
:
VIDEO
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Circuit Boards Location
• Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MB1406 board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
Note 1:
When the MB1406 board is defective, replace the
complete mounted board.
Note 2:
When the complete MB1406 board is replaced, re-
fer to “NOTE OF REPLACING THE COMPLETE
MB1406 BOARD OR CARD WLAN/BT COMBO”
on page 6.
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
Note 1:
When the MB1406 board is defective, replace the
complete mounted board.
Note 2:
When the complete MB1406 board is replaced, re-
fer to “NOTE OF REPLACING THE COMPLETE
MB1406 BOARD OR CARD WLAN/BT COMBO”
on page 6.
DISPLAY board
CARD WLAN/BT COMBO
(WIFI1)
IO board
MB1406 board
KEY board
POWER board
AMP board
REPEATER_REP1
board
REPEATER_REP2
board
NFC module (RC-S730)
(NFC1)
RF modulator
(RF1)
WS board
USB board
Note 3:
When the complete AMP board is replaced, refer to
“NOTE OF REPLACING THE IC7004, IC7005,
IC7007 AND IC7008 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD” on page 6.
Note 3:
When the complete AMP board is replaced, refer to
“NOTE OF REPLACING THE IC7004, IC7005,
IC7007 AND IC7008 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD” on page 6.
Note:
The components identi
fi
ed by mark
0
or
dotted line with mark
0
are critical for safety.
Replace only with part number speci
fi
ed.
Note:
Les composants identi
fi
és par une marque
0
sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spéci
fi
é.
Ver. 1.1
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