Sony HT-RT4, Руководство по обслуживанию

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HT-RT4/RT40
5
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All the units included in the HT-RT4/RT40 (SA-WRT4/WRT40, SS-
RT4/SRT4, remote control) are required to con
fi rm the operation of
SA-WRT4/WRT40. Check in advance that you have all the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
IF “PRTCT” APPEARS IN THE FRONT PANEL
DISPLAY OF THE SUBWOOFER
t
Press
1
to turn off the system. After
the display turns off, disconnect the
AC power cord (mains lead) then
check that nothing is blocking the
ventilation holes of the Subwoofer.
NOTE OF REPLACING THE IC1000 AND IC1002 ON
THE MAIN BOARD (RT4) OR EG4 MAIN BOARD
(RT40) AND THE COMPLETE MAIN BOARD (RT4) OR
COMPLETE EG4 MAIN BOARD (RT40)
When IC1000 and IC1002 on the MAIN board (RT4) or EG4
MAIN board (RT40) and the complete MAIN board (RT4) or
complete EG4 MAIN board (RT40) are replaced, it is necessary
to spread the compound between the MAIN board (RT4) or EG4
MAIN board (RT40) and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the
fi gure below.
– MAIN Board (RT4) or EG4 MAIN Board (RT40)
(Component Side) –
IC1000
thermal compound (G747)
IC1002
thermal compound (G747)
NOTE OF REPLACING BLUETOOTH MODULE OR
RC-S730 (WW)
When the BLUETOOTH MODULE or RC-S730 (WW) is re-
placed, the MAC address for BLUETOOTH MODULE has been
changed. Please execute COLD RESET (refer to page 15) before
pairing with a Bluetooth device / NFC.