1-209
HDC1000/V2 (J, E)
(TG-243CG BOARD (SUFFIX 23-) [HDC1580(CN)])
Ref. No.
or Q’ty Part No. SP Description
C67 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C68 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C69 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C70 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C71 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C72 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C73 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C74 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C75 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C76 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C77 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C78 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C79 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C80 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C81 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C82 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C83 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C84 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C86 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C87 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C88 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C89 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C90 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C91 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C92 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C93 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C94 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C95 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C96 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C97 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C98 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C99 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C100 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C101 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C102 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C103 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C104 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C105 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C106 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C107 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C108 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C109 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C110 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C111 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C112 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C113 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C114 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C115 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C116 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C117 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C118 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C119 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C120 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C121 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C122 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C123 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C124 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C132 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C133 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(TG-243CG BOARD (SUFFIX 23-) [HDC1580(CN)])
Ref. No.
or Q’ty Part No. SP Description
C134 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C135 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C136 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C137 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C138 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C139 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C140 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C141 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C142 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C143 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C144 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C148 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C153 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C154 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C155 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C156 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C157 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C158 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C159 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C160 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C161 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C162 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C163 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C165 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C166 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C169 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C174 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C175 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C176 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C177 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C178 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C179 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C180 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C181 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C184 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C189 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C190 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C191 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C192 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C193 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C194 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C195 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C196 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C197 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C198 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C199 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C200 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C202 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C205 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C206 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C207 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
CN1 1-778-535-31 s CONNECTOR, FFC/FPC(ZIF) AN 45P
CN2 1-764-080-21 o PIN, CONNECTOR (PC BOARD) 8P
CN3 1-770-449-21 s CONNECTOR, BOARD T1 BOARD 70P
D1 8-719-989-04 s DIODE DAN222-TL
Содержание HDC1000 series
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