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3
HCD-XGV6/XGV8/XGV10AV
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Rear Panel –
MODEL
XGV10AV : SP model
XGV10AV : TH model
XGV8 : SP model
XGV6 : TH model
XGV6 : SP model
XGV10AV : EA model
PARTS No.
4-238-825-2
s
4-238-825-3
s
4-238-825-4
s
4-238-825-5
s
4-238-825-6
s
4-238-825-7
s
PART No.
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBY
··································································· 8
4. TEST MODE
···································································· 16
5. MECHANICAL ADJUSTMENTS
····························· 18
6. ELECTRICAL ADJUSTMENTS
······························· 18
7. DIAGRAMS
7-1. Circuit Board Location ······················································ 23
7-2. Block Diagram – CD Servo Section – ······························· 24
Block Diagram – Tuner/Tape Deck Section – ··················· 25
Block Diagram – Main Section – ······································ 26
Block Diagram
– Display/Key Control/Power Supply Section – ·········· 27
7-3. Printed Wiring Board – BD Section – ······························· 28
7-4. Schematic Diagram – BD Section – ·································· 29
7-5. Schematic Diagram –Video (1/2) Section – ······················ 30
7-6. Schematic Diagram –Video (2/2) Section – ······················ 31
7-7. Printed Wiring Board – Video Section – ··························· 32
7-8. Printed Wiring Board – Motor, LED Section – ················· 33
7-9. Schematic Diagram –Motor, LED Section – ····················· 33
7-10. Schematic Diagram – Main (1/3) Section – ······················ 34
7-11. Schematic Diagram – Main (2/3) Section – ······················ 35
7-12. Schematic Diagram – Main (3/3) Section – ······················ 36
7-13. Printed Wiring Board – Main Section – ···························· 37
7-14.Printed Wiring Board
– CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 38
7-15.Schematic Diagram
– CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 39
7-16.Printed Wiring Board – Panel VR Section – ······················ 40
7-17. Schematic Diagram – Panel VR Section – ························ 41
7-18. Printed Wiring Board – Panel FL,TC-A,TC-B Section – · 42
7-19. Schematic Diagram – Panel FL,TC-A,TC-B Section – ····· 43
7-20. Printed Wiring Board – PA Section (XGV10AV) – ··········· 44
7-21. Schematic Diagram – PA Section (XGV10AV) – ············· 45
7-22. Printed Wiring Board – PA Section (XGV6/XGV8) – ······ 46
7-23. Schematic Diagram – PA Section (XGV6/XGV8) – ········· 47
7-24. Schematic Diagram – Sub Amp Section (XGV10AV) – ·· 48
7-25. Schematic Diagram – Sub Amp Section (XGV8) – ·········· 49
7-26. Printed Wiring Board
– Sub Amp Section (XGV10AV/XGV8) – ························· 50
7-27. Schematic Diagram – MIC/Guitar Section – ····················· 51
7-28. Printed Wiring Board – MIC/Guitar Section – ·················· 51
7-29. Printed Wiring Board – Prologic Section (XGV10AV) – ·· 52
7-30. Schematic Diagram – Prologic Section (XGV10AV) – ···· 53
7-31. Printed Wiring Board – Trans,Sub Trans Section – ·········· 54
7-32. Schematic Diagram – Trans,Sub Trans Section – ·············· 55
7-33. IC Pin Function Description ············································· 56
7-34. IC Block Diagram ····························································· 63
8. EXPLODED VIEWS
8-1. Case,Back Panel Section ··················································· 66
8-2. Front Panel Section-1 ························································ 67
8-3. Front Panel Section-2 ························································ 68
8-4. Chassis Section ·································································· 69
8-5. CD Mechanism Deck Section
(CDM37B-30BD62) ··························································· 70
8-6. Base Unit Section (BU-30BD62) ······································ 71
9. ELECTRICAL PARTS LIST
······································· 72
• Abbreviation
SP : Singapore model
TH : Thai model
EA : Saudi Arabia model
Содержание HCD-XGV10AV
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