– 2 –
4-215-642-1
π
EA, MY, SP model
4-215-642-3
π
IA model
4-215-642-4
π
E model
4-215-642-5
π
TH model
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
SP
: Singapore model
MY
: Malaysia model
IA
: Indonesia model
TH
: Thai model
EA
: Saudi arabia model
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
Parts No.
PARTS No.
MODEL
Содержание HCD-VX90AV
Страница 8: ... 8 This section is extracted from instruction manual ...
Страница 26: ...HCD VX90AV 7 3 PRINTED WIRING BOARD BD SECTION See page 18 for Circuit Boards Location 33 34 Page 42 ...
Страница 28: ...HCD VX90AV 7 5 SCHEMATIC DIAGRAM DECK SECTION See page 79 for IC Block Diagrams 37 38 Page 53 B ...
Страница 44: ...HCD VX90AV 7 23 SCHEMATIC DIAGRAM FRONT AMP SECTION 69 70 Page 57 Page 52 Page 68 Page 77 ...