47
47
HCD-SA30
5-21.
Printed
Wiring Boar
d — AMP Section (SIDE B) —
• See page 23 f
or Circuit Boards Location.
•
:
Uses unleaded solder
.
9
5
5
6
6
7
7
8
8
1
1
1
2
3
4
5
6
7
8
9
10
11
12
2
2
3
3
4
4
10
11
12
9
10
11
12
-
REAR R
REAR L
SPEAKER
CENTER
WOOFER
FRONT R
FRONT L
+
-
+
-
+
-
+
-
+
-
+
78
TO
DMB03
BOARD
CN106
(Page 31)
TO
UCOM
BOARD
CN507
(Page 44)
TO
HP BOARD
CNP881
(Page 55)
TO
POWER BOARD
CN905
(Page 59)
TO
POWER BOARD
CN904
(Page 59)
1
5
1
2
1
3
2
1
2
34
9
5
6
10
1
2
11
7
8
12
3
4
1
2
19
20
1
2
19
20
1
2
19
20
1
2
19
20
1
2
19
20
1
2
19
20
IC315
IC314
IC313
IC312
IC311
IC310
IC430
Ref
. No.
Location
•
Semiconductor Location
Ref
. No.
Location
Ref
. No.
Location
D310
A-2
D311
E-2
D312
D-2
D313
C-2
D314
C-2
D315
B-2
D324
A-4
D325
A-4
D336
D-4
D337
E-4
D338
D-4
D339
D-4
D340
C-4
D341
C-4
D342
B-4
D343
B-4
D344
A-4
D345
B-4
D390
B-1
D391
B-1
D392
B-1
D393
B-1
D394
D-1
D395
D-1
D396
A-1
D397
A-1
D401
E-5
IC310
E-3
IC311
D-3
IC312
C-3
IC313
C-3
IC314
B-3
IC315
A-3
IC430
E-3
Q477
A-6