Sony HCD-RX80, Руководство по обслуживанию, Страница: 4 / 90

– 4 –
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
Servicing Notes ........................................................................... 4
1. GENERAL
..................................................................... 5
2. DISASSEMBLY
.......................................................... 22
3. TEST MODE
............................................................... 28
4. MECHANICAL ADJUSTMENTS
.......................... 30
5. ELECTRICAL ADJUSTMENTS
Deck Section ...................................................................... 30
Tuner Section ..................................................................... 33
CD Section ......................................................................... 35
6. DIAGRAMS
6-1. Printed Wiring Board –TUNER Section– ......................... 38
6-2. Schematic Diagram –TUNER Section– ............................ 40
6-3. Printed Wiring Board –CD Section– ................................. 43
6-4. Schematic Diagram –CD Section– .................................... 45
6-5. Printed Wiring Boards –CD MOTOR Section– ................ 47
6-6. Schematic Diagram –CD MOTOR Section– ..................... 49
6-7. Printed Wiring Boards –DECK Section– .......................... 51
6-8. Schematic Diagram –DECK Section– ............................... 53
6-9. Schematic Diagram –MAIN/POWER Section– ................ 57
6-10. Printed Wiring Boards –MAIN/POWER Section– ............ 61
6-11. Schematic Diagram –PANEL Section– ............................. 65
6-12. Printed Wiring Boards –PANEL Section– ......................... 69
6-13. Printed Wiring Board –POWER AMP Section– ............... 73
6-14. Schematic Diagram –POWER AMP Section– .................. 74
6-15. IC Pin Function Description .............................................. 82
7. EXPLODED VIEWS
.................................................. 86
8. ELECTRICAL PARTS LIST
.................................... 94
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering or
unsoldering.