43
43
HCD-RG550/RG660
(Page 38)
(Page 38)
(Page 46)
5-21. PRINTED WIRING BOARD — POWER AMP SECTION — • Refer to page 28 for “5-5. CIRCUIT BOARDS LOCATION”.
: Uses unleaded solder.
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
C514
C518
C522
C512
C517
C521
C511
R537
C513
R504
R502
R597
R503
R595
R81
R99
R86
R55
R92
R95
R56
C33
C540
R571
C527
C524 C526
C525
L501
C34
C37
RY501
C41
C24
LP902
C23
C22
C9
C10
D1
EP01
LP903
CN1
D2
C13
C11
Q533
C12
C531
CN502
CN501
C529
RY502
R570
L502
(–) (+)
L
R
FRONT
SPEAKER
L
R
SURROUND
SPEAKER
JK502(1/2)
JK502(2/2)
IMPEDANCE
USE 6–16
Ω
(
)
IMPEDANCE
USE 24
Ω
(
)
RG660
RG660
RG550
L
R
SPEAKER
JK502
IMPEDANCE
USE 6–16
Ω
(
)
EP501
R538
G
MAIN BOARD CN306
H
MAIN BOARD CN307
K
TRANS BOARD
CN902
(RG660)
J
TRANS BOARD
CN902
(RG550)
R501
R598
D42
D41
D584
(11)
11
POWER AMP BOARD
RG550:1-688-089-
RG660:1-688-699-
(Page 47)
D1
G-9
D2
G-10
D11
F-7
D12
F-8
D13
F-9
D16
F-11
D17
F-11
D18
B-3
D19
B-3
D20
A-3
D23
E-4
D24
G-4
D25
E-4
D29
D-4
D30
D-5
D31
D-4
D32
D-4
D33
C-4
D34
E-4
D35
E-4
D36
E-4
D37
D-4
D38
D-4
D39
F-6
D40
F-6
D41
E-4
D42
F-4
D501
C-4
D502
B-4
D503
C-4
D504
B-4
D505
C-3
D506
B-3
D507
B-4
D508
A-4
D509
C-2
D510
B-4
D511
G-4
D512
I-3
D513
I-5
D514
F-8
D515
I-10
Q5
F-8
Q6
F-8
Q7
F-7
Q8
F-8
Ref. No.
Location
• Semiconductor Location
Ref. No.
Location
Q9
F-8
Q10
B-3
Q11
B-3
Q12
A-3
Q13
A-4
Q17
F-4
Q18
F-4
Q19
F-3
Q20
D-4
Q21
D-4
Q22
E-4
Q23
D-4
Q24
D-4
Q501
E-2
Q502
C-2
Q503
D-2
Q504
B-2
Q505
F-2
Q506
D-3
Q507
E-3
Q508
C-2
Q509
E-3
Q510
C-3
Q511
C-4
Q512
A-3
Q513
C-3
Q514
A-3
Q515
C-4
Q516
B-4
Q517
C-4
Q518
B-4
Q519
C-4
Q520
B-4
Q521
B-4
Q522
A-4
Q523
B-4
Q524
A-4
Q525
C-4
Q526
B-5
Q527
F-5
Q529
I-4
Q530
H-6
Q532
H-4
Q533
I-9
Q534
I-9
Q535
I-8
Q536
I-8