Sony HCD-RG55, Руководство по обслуживанию, Страница: 24 / 74

24
HCD-RG55/RG55S
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 /
4
W or less unless otherwise
specified.
• % : indicates tolerance.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
•
H
: adjustment for repair.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M Ω ).
Voltage variations may be noted due to normal produc-
tion tolerances.
no mark : FM
(
) : CD
[ ] : TAPE
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J : CD
c
: digital out
• Abbreviation
CND : Canadian model
AUS
: Australian model
SP : Singapore model
KR : Korea model
MX : Mexican model
AR : Argentina model
TH : Thai model
for printed wiring boards:
• X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
x
: parts mounted on the conductor side.
• : Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
• Abbreviation
AUS : Australian model
SP : Singapore model
KR : Korea model
MX : Mexican model
AR : Argentina model
E2 : Central and South America model
E51 : Chiri and Peruvian model
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.