Sony HCD-E301, Руководство по обслуживанию

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2
HCD-E301
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
TABLE OF CONTENTS
1. SERVICING NOTES
................................................ 3
2. GENERAL
................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Front Panel Section ......................................................... 7
3-3. MAIN Board ................................................................... 7
3-4. CD Cabinet Section ......................................................... 8
3-5. CD Mechanism Deck (CS-21SC-1280) ......................... 8
3-6. Tape Mechanism Deck (TCM125-2) .............................. 9
3-7. Cassette Lid ..................................................................... 9
4. MECHANICAL ADJUSTMENTS
....................... 10
5. ELECTRICAL ADJUSTMENTS
......................... 10
6. DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
6-2. Schematic Diagram – MAIN Board (1/2) – .................. 14
6-3. Schematic Diagram
– MAIN (2/2)/HEADPHONE Boards – ......................... 15
6-4. Printed Wiring Boards
– MAIN/HEADPHONE Boards – .................................. 16
6-5. Printed Wiring Board – CASSETTE Board – ............... 17
6-6. Schematic Diagram – CASSETTE Board – .................. 17
6-7. Printed Wiring Board – DISPLAY Board – .................. 18
6-8. Schematic Diagram – DISPLAY Board – ..................... 19
6-9. Schematic Diagram – POWER Board – ........................ 20
6-10. Printed Wiring Board – POWER Board – ..................... 21
6-11. IC Pin Function Description ........................................... 23
7. EXPLODED VIEWS
7-1. Cabinet Section ............................................................... 24
7-2. Front Panel Section-1 ...................................................... 25
7-3. Front Panel Section-2 ...................................................... 26
7-4. CD Cabinet Section ......................................................... 27
8. ELECTRICAL PARTS LIST
............................... 28