Sony CMT-G1BIP, Руководство по обслуживанию

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HCD-G1BiP/G1iP
2
1. SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 8
2-2. Case ................................................................................. 9
2-3. Panel (CD Tray) .............................................................. 9
2-4. Panel (Front) Block ......................................................... 10
2-5. Panel (Rear) Block .......................................................... 11
2-6. MAIN
Board ................................................................... 12
2-7. Holder (CD Front) Block ................................................ 14
2-8. AMP Board Block ........................................................... 14
2-9. AMP
Board ..................................................................... 15
2-10. Power Transformer (T901) ............................................. 16
2-11. CD Mechanism Deck Block (CDM77B-K6BD94D) ..... 17
2-12. Belt .................................................................................. 17
2-13. Base Unit (BU-K6BD94D) ............................................. 18
2-14. Optical Pick-up Block (KSM-213DCP) ......................... 18
2-15. Holder (CD) Block .......................................................... 19
2-16. DCDC Board ................................................................... 19
3. TEST MODE
............................................................ 20
4. ELECTRICAL CHECK
......................................... 21
5. DIAGRAMS
5-1. Block Diagram - CD, USB, PANEL Section -................ 23
5-2. Block Diagram - TUNER, AUDIO IN,
HEADPHONE OUTPUT Section - ................................ 24
5-3. Block Diagram
- AMP, SPEAKER OUTPUT Section - .......................... 25
5-4. Block Diagram - POWER SUPPLY Section - ................ 26
5-5. Printed Wiring Board - BD94D Board - ......................... 28
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
iPhone, iPod, iPod classic, iPod nano, and iPod touch
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
Windows Media is either a registered trademark or
States and/or other countries.
distribution of such technology outside of this product
All other trademarks and registered trademarks are of
their respective holders. In this manual,
™
and
®
marks
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classifie d as a CLASS 1
LASER pro d uct. This m arkin g is locate d
on the rear exterior.
5-6. Schematic Diagram - BD94 Board - ............................... 29
5-7. Printed Wiring Board - TUNER Board - ........................ 30
5-8. Schematic Diagram - TUNER Board - ........................... 30
5-9. Printed Wiring Board - DAB Board (G1BiP) - ............... 31
5-10. Schematic Diagram - DAB Board (G1BiP) - ................. 31
5-11. Printed Wiring Board - MAIN Board (Side A) - ............ 32
5-12. Printed Wiring Board - MAIN Board (Side B) - ............ 33
5-13. Schematic Diagram - MAIN Board (1/3) - ..................... 34
5-14. Schematic Diagram - MAIN Board (2/3) - ..................... 35
5-15. Schematic Diagram - MAIN Board (3/3) - ..................... 36
5-16. Schematic Diagram - AMP Section - .............................. 37
5-17. Printed Wiring Board - AMP Section (1/2) - .................. 38
5-18. Printed Wiring Boards - AMP Section (2/2) - ................. 39
5-19. Printed Wiring Boards
- HP/JOG1/JOG2/USB Boards - .................................... 40
5-20. Schematic Diagram - HP/JOG1/JOG2/USB Boards - .... 41
5-21. Printed Wiring Board - FL Board - ................................. 42
5-22. Schematic Diagram - FL Board - .................................... 43
5-23. Printed Wiring Boards - POWER Section - .................... 44
5-24. Schematic Diagram - POWER Section - ........................ 45
6. EXPLODED VIEWS
6-1. Overall Section ............................................................... 57
6-2. Front Panel Section ......................................................... 58
6-3. Rear Panel Section .......................................................... 59
6-4. MAIN Board Section ...................................................... 60
6-5. Chassis
Section ............................................................... 61
6-6. CD Mechanism Deck Section
(CDM77B-K6BD94D) ................................................... 62
7. ELECTRICAL PARTS LIST
.............................. 63