Sony CDX-M9900 Operating Instructions (primary manual), Руководство по обслуживанию

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4
CDX-M9900/M9905X
TABLE OF CONTENTS
1. GENERAL
Location of Controls ................................................................ 5
Connections ............................................................................. 6
2. DISASSEMBLY
2-1. Front Panel Assy ................................................................. 8
2-2. Sub Panel Assy .................................................................... 8
2-3. CD Mechanism Block ......................................................... 9
2-4. Driving Section ................................................................... 9
2-5. Driven (F) Assy, Driving (F) Assy .................................... 10
2-6. Digital Board ..................................................................... 10
2-7. Main Board ....................................................................... 11
2-8. Chassis (T) Sub Assy ........................................................ 11
2-9. Roller Arm Assy ................................................................ 12
2-10. Chassis (OP) Assy ............................................................. 12
2-11. Optical Pick-up ................................................................. 13
2-12. SL Motor Assy (M902) ..................................................... 13
2-13. LE Motor Assy (M903) ..................................................... 14
2-14. Servo Board ....................................................................... 14
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 15
3-2. Block Diagram –CD Section– ........................................... 20
3-3. Block Diagram –Main Section– ........................................ 21
3-4. Block Diagram –Display Section– .................................... 22
3-5. Circuit Boards Location .................................................... 23
3-6. Waveforms ......................................................................... 23
3-7. Note for Printed Wiring Boards and
Schematic Diagrams .......................................................... 24
3-8. Printed Wiring Boards –CD Mechanism Section– ............ 25
3-9. Schematic Diagram –CD Mechanism Section (1/2)– ....... 26
3-10. Schematic Diagram –CD Mechanism Section (2/2)– ....... 27
3-11. Printed Wiring Board –Main Section– .............................. 28
3-12. Schematic Diagram –Main Section (1/3)– ........................ 30
3-13. Schematic Diagram –Main Section (2/3)– ........................ 31
3-14. Schematic Diagram –Main Section (3/3)– ........................ 32
3-15. Schematic Diagram –Display Section– ............................. 33
3-16. Printed Wiring Board –Display Section– .......................... 34
3-17. IC Block Diagrams ............................................................ 35
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 41
4-2. Main Board Section .......................................................... 42
4-3. Front Panel Section ........................................................... 43
4-4. CD Mechanism Section (1) ............................................... 44
4-5. CD Mechanism Section (2) ............................................... 45
4-6. CD Mechanism Section (3) ............................................... 46
4-7. CD Mechanism Section (4) ............................................... 47
5. ELECTRICAL PARTS LIST
........................................ 48
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.