CDP-XB930/XB930E
13
13
SECTION 6
DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION
POWER SW board
KEY board
HP board
ROTARY SW board
DISP board
SERVO board
POWER board
TRANS board
SLED board
SPINDLE board
LD IN SW board
MAIN board
LOADING
board
4.0Vp-p
8MHz
1
TP1 (RF)
1.2Vp-p
(PLAY)
5
IC801
#ª
(EXTAL)
3
IC301
%¢
(128FSO)
2
CN304
!¡
4.0Vp-p
3.0Vp-p
5.6448MHz
(128Fs)
16.9344MHz
4.8Vp-p
45MHz
4
IC301
@•
(XOUT)
• Waveform
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
1
: fusible resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
c
: DIGITAL OUT
For printed wiring boards.
Note:
•
X
: parts extracted from the component side.
•
®
: Through hole.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in each
block.)
Note: The components identified by mark
!
or dotted line
with mark
!
are critical for safety.
Replace only with part number specified.
