XBR-55X850D/855D/857D, 65X850D/855D/857D, 75X850D/855D/857D
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APPENDIX-2
How to disassemble HEAT SINK (DPS board)
<NOTE>
HEAT SINK are already attached to the DPS board for service.
If you need to disassemble HEAT SINK from DSP board for repair,
Please cut
HOLDER,HS WS(MUF)
with tool (nippers) from B side of DPS board.
However, please do it carefully because some damage may be given
to the neighborhood parts or the DPS board itself.
When you re-assemble HEAT SINK,
Do not reuse HOLDER,HS WS. Should be replaced to new parts.
And
Potting operation is necessary
at the same time for re-assembly of HEAT SINK.
Please refer SBR "New Potting TIM Operation for board repair" for details.
nipper
HOLDER, (HS MUF)
4-549-188-01
HOLDER, HS WS (MUF)
4-548-743-01
Do not reuse HOLDER.
Should be replaced to new parts.
HEAT SINK (MUFF)
Unhook HOLDER,(HS MUF)
Push
Содержание Bravia XBR-55X857D
Страница 134: ...XBR 55X850D 855D 857D 65X850D 855D 857D 75X850D 855D 857D 134 DISASSEMBLY 3 4 HSC4 S 3 SMART CORE S HSC4 S 1 3 2 NOTE ...
Страница 174: ...XBR 55X850D 855D 857D 65X850D 855D 857D 75X850D 855D 857D 174 DISASSEMBLY 5 3 COVER TOP 5 SMART CORE M COVER TOP 1 3 2 ...
Страница 175: ...XBR 55X850D 855D 857D 65X850D 855D 857D 75X850D 855D 857D 175 DISASSEMBLY 5 4 HSC4 M 5 SMART CORE M HSC4 M 1 3 2 NOTE ...