AIR-SA10
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTE THE S-AIR COMMUNICATION CONFIRMING
EZW-RT10 of the attachment is necessary for the confi rmation of
S-AIR communication.
Confi rm S-AIR after inserting EZW-RT10 in the set (AIR-SA10).
DIRECTION OF EZW-RT10 INSTALLATION
When EZW-RT10 is install with the S-AIR RX-IF board detached
of the set, the label of EZW-RT10 is the under and install.
SECTION 1
SERVICING NOTES
S-AIR RX-IF board
EZW-RT10
label
