Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface
Datasheet
SMSC USB3290
15
Revision 1.5 (11-02-07)
DATASHEET
Note 6.3
V
DD3.3
= 3.0 to 3.6V; V
SS
= 0V; T
A
= -40
o
C to 85
o
C; unless otherwise specified.
Note 6.4
V
DD3.3
= 3.0 to 3.6V; V
SS
= 0V; T
A
= -40
o
C to 85
o
C; unless otherwise specified.
High Speed High Level
Output Voltage (DP/DM
referenced to GND)
V
HSOH
45
Ω
load
360
440
mV
High Speed IDLE Level
Output Voltage (DP/DM
referenced to GND)
V
OLHS
45
Ω
load
-10
10
mV
Chirp-J Output Voltage
(Differential)
V
CHIRPJ
HS termination resistor
disabled, pull-up resistor
connected. 45
Ω
load.
700
1100
mV
Chirp-K Output Voltage
(Differential)
V
CHIRPK
HS termination resistor
disabled, pull-up resistor
connected. 45
Ω
load.
-900
-500
mV
Leakage Current
OFF-State Leakage Current
I
LZ
± 1
uA
Port Capacitance
Transceiver Input Capacitance
C
IN
Pin to GND
5
10
pF
Table 6.4 Dynamic Characteristics: Analog I/O Pins (DP/DM) (
)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP MAX
UNITS
FS Output Driver Timing
Rise Time
T
FSR
C
L
= 50pF; 10 to 90% of
|V
OH
- V
OL
|
4
20
ns
Fall Time
T
FFF
C
L
= 50pF; 10 to 90% of
|V
OH
- V
OL
|
4
20
ns
Output Signal Crossover
Voltage
V
CRS
Excluding the first
transition from IDLE state
1.3
2.0
V
Differential Rise/Fall Time
Matching
FRFM
Excluding the first
transition from IDLE state
90
111.1
%
HS Output Driver Timing
Differential Rise Time
T
HSR
500
ps
Differential Fall Time
T
HSF
500
ps
Driver Waveform
Requirements
Eye pattern of Template 1
in USB 2.0 specification
See
High Speed Mode Timing
Receiver Waveform
Requirements
Eye pattern of Template 4
in USB 2.0 specification
See
Data Source Jitter and
Receiver Jitter Tolerance
Eye pattern of Template 4
in USB 2.0 specification
See
Table 6.3 DC Electrical Characteristics: Analog I/O Pins (DP/DM) (
Note 6.3
) (continued)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP MAX
UNITS