Smart Machine Smart Decision
7.
Manufacturing
7.1.
Top and Bottom View of SIM800H
Figure 54: Top and bottom view of SIM800H
7.2.
Typical Solder Reflow Profile
Figure 55: Typical solder reflow profile
7.3.
The Moisture Sensitivity Level
The moisture sensitivity level of SIM800H module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30
℃
and relative humidity of <60% (RH). It is
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Содержание SIM800H
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