SMT module de-soldering and rework Guidelines
4 Manual de-soldering process
Recommended operation for manual de-soldering:
z
Hot air heating the pads of the SIM300DZ module
z
Check whether the solder is molten
z
Remove the nozzle of the hot air soldering gun and remove the SIM300DZ module with a
pair of tweezers
z
Put the SIM300DZ module on the smoke absorber for cooling down
4.1 PCBA with Single side components placement
If the PCBA is designed with single side placement, it is recommended to preheat the bottom of
the PCBA. Course of preheating the PCBA can permits lower soldering reflow temperature and
reduces thermal stresses to the PCB substrate when localized reflow is made with hot air nozzle.
The illumination of the operation for manual de-soldering:
z
Fix the position of the PCBA on the adjustable board cradle
z
Preheating the PCBA with the temperature about
150
℃
z
handle the hot air soldering gun and take equably heating to the pads of the SIM300DZ
module
Hot air soldering gun
SIM300D module
Make example for PCBA
PCB preheater
Figure 4: De-soldering with preheater
4.2 PCBA with both sides components placement
If the PCBA is designed with both sides placement, it is recommended to change the soldering tip
for customized square hot air nozzle for heating with a pair of tweezers.
The illumination of the operation for manual de-soldering:
z
Handle the hot air soldering gun, make the square nozzle cover the SIM300DZ module and
Module de-soldering and rework _UGD_V1.01 07.12.2009
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