Smart Machine Smart Decision
SIM800H _Hardware Design_V2.03
61
2016-10-10
7.3.
The Moisture Sensitivity Level
The moisture sensitivity level of SIM800H module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30
℃
and relativ
necessary to bake the module if the above conditions are not met:
Table 51: Moisture sensitivity level and floor life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
1
Unlimited at
≦30℃/85% R H
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
Note: For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4.
Baking Requirements
SIM800H modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
the following conditions: the environment temperature is lower than 40
℃
, and the air h
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of
permanent damage during re-flow soldering.
If the vacuum package is broken or leakage
;
If the vacuum package is opened after 6 months since it’s been packed
;
If the vacuum package is opened within 6 months but out of its Floor Life at factory
ambient
≦30℃/60% R H or as stated
.
Table 52: Baking requirements
Baking temperature
Moisture
Time
40
℃±5℃
<5%
192 hours
120
℃±5℃
<5%
6 hours
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, otherwise the
tray may be damaged by high-temperature heating.
SIMCOM
CONFIDENTIAL
FILE
