S e n s o r P u c k
Rev. 1.0
11
5.3. Layout
Figure 12 shows the layout of the puck. The Bluetooth module has a keep and area and is placed on the backside
to avoid antenna detuning. The inner power and ground layers are not shown.
Figure 12. Silkscreen, Front and Back Metal
1 R11
47
±1%
CR0402-16W-
47R0F
Venkel
2 R13,R14
2 K
±1%
CR0402-16W-
2001F
Venkel
4 SF4,SF5,SF6,SF7
BUMPER
SJ61A6
3M
1 SW1
SW_SLIDE_2POS
NK236H
Apem Inc.
4 TPV1,TPV2,TPV5,TP
V6
TPV
N/A
N/A
2 TP1,TP2
RED
151-207-RC
Kobiconn
1 U1
BCM20732i
3.3 V
BCM20732i
iDevices
1 U2
EFM32G210
3.3 V
EFM32G210F12
8-QFN32
SiLabs
1 U3
24 MHz
FA-238
24.0000MB
Epson
1 U4
TS3310
5 V
TS3310ITD1022 SiLabs
1 U5
Optical Sensor
Si1147-M01-GM SiLabs
1 U6
Si7021
Si7021-A10-GM1 SiLabs
Table 1. Sensor Puck BOM (Continued)
Quantity
Reference
Value
Voltage
Tol
Manufacturer
Part Number
Manufacturer