Package Information
C500 Family
Semiconductor Group
5-1
1998-04-01
5
Package Information
This chapter shows typical package outlines of the packages which are actually used for the
microcontrollers of the C500 family. The appropriate data sheet should always be regarded when
the package of a specific C500 microcontroller has to be referenced.
5.1
P-DIP Package
Figure 5-1
P-DIP-40-3 Package Outlines
P-DIP-40-3
(Plastic Dual In-line Package)
Dimensions in mm
SMD = Surface Mounted Device
GPD05883