Product Specification
w w w . s h u t t l e . c o m
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
Fax +49 (0) 4121-47 69 00
[email protected]
Page 7
| 5 June 2013
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Shuttle XPC Barebone SH67H3 Specifications
H3-Chassis
Black aluminum chassis
Storage bays: 1 x 5.25" (external), 2 x 3.5" (1x internal, 1x external)
Dimensions: 32.3 x 20.8 x 18.9/19.6 cm (LWH) without/with rubber feet
Weight: 3.2 kg net / 5.0 kg gross
Mainboard
and Chipset
Shuttle FH67, Shuttle form factor, proprietary design for XPC SH67H3
Chipset/Southbridge: Intel® H67 Express (Codename: Cougar Point)
Platform Controller Hub (PCH) as Single-Chip-Solution
Passive chipset cooling with heat sink
The Northbridge is integrated into the processor.
Solid Capacitors for sensitive areas provide excellent
heat resistance for enhanced system durability
BIOS
AMI BIOS, SPI Interface, 32MBit Flash-ROM
Supports PnP, ACPI 3.0, Hardware Monitoring
Supports Unified Extensible Firmware Interface (UEFI)***
Supports boot up from external USB flash memory
Power Supply
300 Watt mini PSU, AC input voltage: 100~240V
80 PLUS® certified (80% or greater energy-efficient)
Active PFC circuit (Power Factor Correction)
ATX main power connectors: 2x10 and 2x2 pins
Graphics power connector: 6 pins
Processor
Support
Socket 1155 (LGA 1155) supports the second and third generation of
Intel Core i3 / i5 / i7 / Pentium / Celeron processors with up to 95W TDP
- Codename "Sandy Bridge", 32nm process technology and
- Codename "Ivy Bridge", 22nm process technology
Does not support unlock-function of Intel® K-Series processors.
Not compatible with older Socket-1156 processors.
The Processor integrates PCI-Express, memory controller
and the graphics engine on the same die (depends on processor type)
Ivy Bridge processors are supported since
mainboard version FH67 V2 and BIOS version SH67H000.201.
Please refer to the support list for detailed processor support information.
Processor
Cooling
Shuttle I.C.E. (Integrated Cooling Engine)
advanced I.C.E. Heatpipe technology, linear controlled 92mm fan
SilentX cooling and noise reduction technology with Active Airflow
Memory
Support
4 x 240 pin slots
Supports DDR3-1066/1333 SDRAM memory (PC3-8500/10600)
Supports 2+2 Dual Channel mode
Supports max. 8 GB per DIMM, maximum total size of 32 GB
